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 SMD
FYLS 1210 /YGC 10S FYLS - 1210SR/YGC
Features:
Compatible with automatic placement equipment Compatible with reflow solder process.
Radiation pattern.
Applications:
Automotive-Telecommumication Indicators Lcd Back-lights Illuminations
Descriptions:
Dice material: RAlGaInP GAlGaInP Emitting Color: RSuper Deep-Red. GSuper Yellow Green. Lens Color: Water clear.
Relative Lumionous Intensity(LOP @max=1)
ratings(Ta=25 Absolute maximun ratings(Ta=25)
Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current Derating Linear From 25 Operating Temperature Range Storage Temperature Range Soldering Temperature MAX. Unit
60 60 20 0.4
mW mA mA mA/
-30 to +80 85 -40 to +85 260 260 ( for 5 second )
characteristics(Ta=25 Electrical and optical characteristics(Ta=25) Parameter
Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current
Symbol
IV R G
Min.
25 16 120 --634 568 25
Typ.
30 25 130 650 575 639 573 30 2.0 2.0
Max.
--140 --644 578 35 2.4 2.4 10
Unit
mcd Deg nm
Test Condition
21/2 p R G R G
IF=20mA nm nm V A VR=5V
d VF IR
R G
---
SMD
Typical Electrical Characteristics Curves (25 (25 Ambient Temperature Unless Otherwise Noted)
Luminous
Intensity Vs.forward
Current
Luminous
Intensity Vs.forward
Current
1000
luminous intensity(%)
50
40
luminous intensity(%)
100
30
20
10
Relative
10
Relative
0 1.2
0 1 10 100 1000
Forward Voltage(VF)- volts
1.6
2.0
2.4
2.8
3.2
Forward Current(mA) Luminous Intensity Vs. Ambient Temperature Forward Current Derating Curve 60 50 Forward Current(mA) 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 Relative Luminous Intensity
Ambient Temperature TA( )
Ambient Temperature TA( C )
SMD
Precautions For Use
Over-current-proof
Customer must apply resistors for protection,otherwise slight voltage shift will cause big current chang(Burn out will happen)
Storage 1. The operation of temperature and R.H are:5 ---30,R.H.60% Max. 2. Once the package is opened ,the products should be used within a week. Otherwise,they
Should be kept in a dampproof box with desccating regent.Considering the tape life,we Suggest our customers to use our products within 1.5year (form production date).
3. It's recommended to bake before soldering when the package is unsealed after 72hrs.The
Condition is: 60 5 for 15 hrs.
Soldering Iron:
Temperature at tip of iron:300 Max.(25W Max) Soldering time:31sec.
Reflow Temp./Time:
Temperature Time
SMD
Package Package Dimensions of Device
Soldering
Cathode Mark
Terminal
2.7
0.5 0.6
-
1.0
Die 2 Die 1
2.0
3.2
0.4
+
PCB
1.5 0.6
Resin
2.0
1.5
1.4
1.1
Unit:mm
Tape Specification: 3000pcs Per Reel. Packing
Item Spec. Tolerance Item Spec. Tolerance
W P1 E F
Size
D0 D1 P0
Unit
mm mm
8.00 0.20 10P0 40.00 0.20
Cathode
4.00 0.10 P2 2.00 0.05
D0 P2
1.75 0.10 A0 2.80 0.10
3.50 0.05 B0 3.35 0.10
P0
1.50 +0.1/-0 K0 1.35 0.10
1.00 0.05 T 0.22 0.05
E K0
4.00 0.05
Unit
mm mm
A'
D1
F W 5 P1 A0
A' SEC:A-A'
t
Package Dimensions of Reel:
60+0.5/-0
13.50.2
1781.0
120.15 90.1
Unit:mm
SMD
Packing and Shipping Spec.
L1
sb
sb
Zip-lock
Desiccant Antistatic Bag
W1
Desiccant Spec.
Spec. 203.0.
Spec. 198.0
Unit:mm
Box Dimension(cm):30 * 19* 11.5
s) pc Y( 'T Q . NO
RT PA
10 Reels per box
CARTON Dimension(cm):39*32*38 6boxs/carton 0603B/0603/0805: 4000pcs*10Reels*6boxs 0805B/1206B/1206 1210/1204: 3000pcs*10Reels*6boxs* 3528:2000pcs*10Reels*6boxs 5050:1000pcs*8Reels*6boxs
S KG KG W M G. 8C *3 W 31 N. 8* :3 AS S
C/NO
ME


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